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商品名称:

工业用 Half-Slim固态硬盘提供闪存硬盘技术的所有

所属类别:工业级H-Slim

浏览次数:

规格: 1GB-256GB

描述:串行ATA III接口 (SATA III) Half-Slim固态硬盘提供闪存硬盘技术的所有优势,其中一型是一个设计完全符合JEDEC MO-297标准的PCB标准Half-Slim外形;而另外一型是完全符合标准的2.5-英寸外形,包含标准的7针数据段接口和15针的电源接口部分。该模块提供相较于传统硬盘的低功率消耗特性和热插入拆卸/更换/升级固态硬盘(SSD),以及在最高300MHz之运作频率与40MHz的外部石英晶体谐振器工作频率下设计而成的。如采用SLC闪存的解决方案,它可以提供多种容量,最高达64GB。此外,基于东芝的32nm/24nm Toggle SLC闪存技术,它可以达到500MB/ s的读取和140MB/ s的写入高性能。

参数介绍

产品规格

 

 Solution

PS3107-S7

 PS3108-S8

 PS3109-S9

 Capacity

1GB~128GB

 1GB~128GB

 1GB~256GB

 Compliance

SATA 2.0

 SATA 3.0

 SATA 3.0

 Flash Memory

SLC/pSLC/MLC

 Performance (Note1)

Read: up to 190 MB/s
Write: up to 185 MB/s

 Read: up to 520 MB/s
Write: up to 130 MB/s

 Read: up to 510 MB/s
Write: up to 190 MB/s

 Power Consumption (Note1)

 Active mode:< 1,550 mW

 Active mode: < 3,100 mW  Active mode: < 2,000 mW

 General Applications

Storage, Recording, Back up, Boot device, Database in Server, NAS, SAN, Surveillance, Industrial PC/machines

 Operating Voltage

 DC 5.0V

 Operating Temperature

 0°C ~ 70°C (Silver)
-40°C ~ 85°C (Diamond)

 Reliability (Note2)

IEC-60068, IEC-61000, MIL-STD-810, ISTA 2 Series

 MTBF

More than 1,000,000 hours

 More than 2,000,000 hours

 Quality

Products are tested with both operational and non-operational status to ensure the highest qualities.

 Features

DEVSLP mode, Static/Dynamic Wear leveling, Error Correcction Code (ECC),Power Loss Protection, SMART Function, TRIM, Over-Provision, pSLC support, Conformal Coating, Secure Erase

 Datasheet

 工业用 Half-SlimHS-SSD.pdf

 

Note 1: Performance and Power Consumption may differ according to flash type, flash configuration, and platform.

Note 2: All reliability tests follow international standards

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